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INTRODUCTION
This kit provides a solid mechanical platform with good shield-
ing and grounding to breadboard eight pin TO-3 packages or the
MO-127 package with 0.060" pins. This kit is not intended as
an alternate for kits dedicated to specific amplifiers. See www.
apexmicrotech.com for availability of dedicated kits.
Construction will involve surface mounting and 3D techniques.
Holes are provided to mount standard banana and BNC connec-
tors for I/O. See the Apex Accessories Information data sheet
for a selection of flat-back heatsinks and thermal washers for
these packages.
Note that HS11 is compatible with EK09 and all three sockets
can be used if desired. If the EK09 is to be used as an MO-127
platform only, HS18 rated at 1° C/W is a cost effective alterna-
tive to HS11 if internal power dissipation permits. Lower cost
alternatives for two package TO-3 applications are HS02, HS01,
and HS09. For single package TO-3 applications the HS13 is
also suitable. The six chip capacitors provided can be used as
the critical first step in power supply bypass for dual supplies
for all three sockets. These capacitors are rated at 200V.
ASSEMBLY
Let us define the side of the top board with solder pads for each
pin (roughly triangular on the TO-3 sockets) as the component
side, where all the support components will determine circuit
function and will be inside the finished box. The other side of
this board is hereby dubbed the amplifier side.
Insert cage jacks from the amplifier side and solder. Consider
one of these techniques: 1) Place cage jacks in holes, cover
with one of the 6" copper sides, flip over and solder, or 2) place
cage jacks on pins of the amplifier, insert and solder. If done
carefully, technique 2 can be used for the MO-127 package
with 0.040" leads.
Starting with one short and one long side, locate a vertical
square corner in your work area (a large heatsink standing
on end works fine) and solder the two together. Repeat for
the other two sides, and finally solder the two pairs together.
With the component side up , place rectangle of sides on top
and tack two opposite corners. When satisfied with alignment,
solder the box together then add connectors and components
as desired.
Note that copper on the inside and on the top of the box will
all be tied to ground. Copper on the four outer sides of the box
will be floating unless you tie them down.
Soldering a stranded #10 to #16 ground wire from the immedi-
ate area of the socket(s) to the ground connector of the power
supply(ies) is good construction practice. If the circuit is not a
bridge, run this same size wire from the socket area to the out-
put return connector. This will avoid high currents in the ground
plane which may destroy signal integrity or even an amplifier.
This is a good time to think about star grounding where each
ground connection has a dedicated path to the center of the
star such that currents in any path are not capable of inducing
voltage in any other path.
Note that the layout makes it easy to locate the star center
nearly coincident with the socket center.
Auxiliary circuits may be mounted inside the box in 3-D fash-
ion supported on ground connections or on daughter boards
as convenient. Other style connectors, switches or indicators
can easily be added by simply drilling the appropriate holes
and mounting them.
PARTS LIST
Part #
PB99-P2
PB99- P6
PB99-P7
MS02
MS04
OX7R105KWN
Description
Quantity
top
1
side
2
side
2
cage jacks for one TO-3 socket
2
cage jacks for one MO-127 socket
1
1µF Cap 1825B105K201N,Novacap 6
BEFORE YOU GET STARTED
• Attempt to visualize the finished circuit mechanically and in
terms of where the high currents flow.
• Use proper ESD precautions.
• Verify heatsink is adequate
• Use thermal grease or Apex thermal washer.
• Do not make or break any connection on a hot circuit.
• Start with lowest rated voltages.
• Checking for oscillations with an oscilloscope is a must.
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
1
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