CPA241
M I C R O T E C H N O L O G Y
ABSOLUTE MAXIMUM RATINGS
SUPPLY VOLTAGE, +V
S
to –V
S
OUTPUT CURRENT, continuous
INPUT VOLTAGE, differential
INPUT VOLTAGE, common mode
TEMPERATURE, junction
350V
60mA
±16V
±V
S
150°C
NOTE:
Refer to parent product data sheet PA241 for typical AC electrical characteristics, precautions,
applications and other test parameters.
DC WAFER PROBED SPECIFICATIONS
PARAMETER
OFFSET VOLTAGE, initial
BIAS CURRENT, initial
COMMON MODE REJECTION
VOLTAGE SWING
SUPPLY CURRENT, quiescent
TEST CONDITIONS
1
V
S
= ±50V
V
CM
= ±90 V DC
I
O
= 40mA
V
S
= ±50 V
84
±V
S
–12
1.8
MIN
TYP
15
56
94
±V
S
–10
2.1
MAX
40
200
2.3
UNITS
mV
pA
dB
V
mA
NOTES:
1.
2.
Unless otherwise stated V
S
= ±50 V, T
A
= 25°C, DC input specification ± value given.
Sample tested by wafer to 95%.
TYPICAL EXTERNAL CONNECTIONS
DIE LAYOUT
* Required component and value if given.
Optional balance components are recommended values.
C
C
is NPO, rated for full supply voltage –V
S
to +V
S
.
NOTE:
Diagram for connection illustration only.
All op amp configurations are possible.
Pad
1
2
3
4
Function
Output
Compensation
Compensation
Current Limit
Pad
5
6
8
9
Function
+Vs
-Vs
+IN
-IN
Dimension: 154.5 x 117.5 ± 2.5 Mils.
Thickness: 15 Mil (380µ).
Backside Metal: None, Silicon.
Bond pad: 5 Mil sq (127µ) AI.
Make no connection to bond pads not listed by function.
Note: The backside of the CPA241 die is isolated up to
500V. The top side walls of the CPA241 die are isolated up
to 300V.
Ordering Information:
Order #: CPA241DI80:
Die are only available in waffle packages with a total of 80
die per package.
CAUTION
The CPA241 is a MOSFET amplifier. ESD handling
procedures must be observed
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible
ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 •
inaccuracies or omissions. All specifications are subject to change without notice.
CPA241 REV B OCTOBER 2006 © 2006 Apex Microtechnology Corp.
1
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