II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Filler % (Spherical/Flake)
Flammability Rating
Backside Metallization
Moisture Level
AO4946
Standard sub-micron
low voltage N channel process
8 leads SOIC
Copper with Ag spot
Ag epoxy
S：2mils Cu; G: 1.3mils Au
Epoxy resin with silica filler
90/10
UL-94 V-0
Ti / Ni / Ag
Up to Level 1 *
AO4946L (Green Compound)
Standard sub-micron
low voltage N channel process
8 leads SOIC
Copper with Ag spot
Ag epoxy
S：2mils Cu; G: 1.3mils Au
Epoxy resin with silica filler
100/0
UL-94 V-0
Ti / Ni / Ag
Up to Level 1*
Note *
based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AO4946 (Standard) &
AO4946L (Green)
Test Item
Test Condition
Time
Point
0hr
Lot Attribution
Total
Sample
size
17380 pcs
Number
of
Failures
0
Solder
Reflow
Precondition
HTGB
Standard: 1hr PCT+3
cycle reflow@260°c
Green: 168hr 85°c
/85%RH +3 cycle
reflow@260°c
Temp = 150°c ,
Vgs=100% of Vgsmax
Standard: 83 lots
Green: 29 lots
168 / 500
hrs
1000 hrs
1 lot
82 pcs
77+5 pcs /
lot
82 pcs
77+5 pcs /
lot
5335 pcs
50+5 pcs /
lot
5665 pcs
50+5 pcs /
lot
6380 pcs
50+5 pcs /
lot
0
(Note A*)
1 lot
HTRB
Temp = 150°c ,
Vds=80% of Vdsmax
168 / 500
hrs
1000 hrs
0
(Note A*)
Standard: 81 lots
Green: 16 lots
(Note B**)
Standard: 83 lots
Green: 20 lots
(Note B**)
Standard: 87 lots
Green: 29 lots
(Note B**)
HAST
130 +/- 2°c , 85%RH,
33.3 psi, Vgs = 80% of
Vgs max
121°c , 29.7 psi ,
100%RH
100 hrs
0
Pressure Pot
96 hrs
0
Temperature
Cycle
-65°c to 150°c ,
air to air
250 / 500
cycles
0
3
AOSMD [ ALPHA & OMEGA SEMICONDUCTORS ]
