Thermal Characteristics : n-channel , p-channel and schottky
Parameter
Maximum Junction-
to-Ambient
Maximum Junction-
to-Ambient
Maximum Junction-
to-Lead
Maximum Junction-
to-Ambient
Maximum Junction-
to-Ambient
Maximum Junction-
to-Lead
Maximum Junction-
to-Ambient
Maximum Junction-
to-Ambient
Maximum Junction-
to-Lead
t ≤ 10s
Steady-
State
Steady-
State
t ≤ 10s
Steady-
State
Steady-
State
t ≤ 10s
Steady-
State
Steady-
State
Symbol
R
θJA
Device
n-ch
n-ch
R
θJL
R
θJA
n-ch
p-ch
p-ch
R
θJL
R
θJA
p-ch
schottky
schottky
R
θJL
schottky
Typ
48
74
35
48
74
35
47.5
71
32
Max
62.5
110
40
62.5
110
40
62.5
110
40
°C/W
°C/W
°C/W
Units
II. Package Information:
AO4915
Process
Standard sub-micron
low voltage P channel process
Package Type
8 lead SOIC
Lead Frame
Copper with Solder Plate
Die Attach
Silver epoxy
Bond wire
2 mils Au wire
Mold Material
Epoxy resin with silica filler
Filler % (Spherical/Flake)
90/10
Flammability Rating
UL-94 V-0
Backside Metallization
Ti / Ni / Ag
Moisture Level
Up to Level 1 *
AO4915 (Green Compound)
Standard sub-micron
low voltage P channel process
8 lead SOIC
Copper with Solder Plate
Silver epoxy
2 mils Au wire
Epoxy resin with silica filler
100/0
UL-94 V-0
Ti / Ni / Ag
Up to Level 1*
Note *
based on info provided by assembler and mold compound supplier
AOSMD [ ALPHA & OMEGA SEMICONDUCTORS ]
