APL5501/2/3
Classification Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
Package Thickness
Volume mm3
<350
Volume mm3
350
<2.5 mm
³ 2.5 mm
240 +0/-5°C
225 +0/-5°C
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness
Volume mm3
<350
Volume mm3
350-2000
Volume mm3
>2000
<1.6 mm
1.6 mm – 2.5 mm
³ 2.5 mm
260 +0°C*
260 +0°C*
250 +0°C*
260 +0°C*
250 +0°C*
245 +0°C*
260 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and
including the stated classification temperature (this means Peak reflow temperature +0°C.
For example 260°C+0°C) at the rated MSL level.
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
Description
245°C, 5 SEC
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
TST
ESD
Latch-Up
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
°
°
-65 C~150 C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
Carrier Tape & Reel Dimensions
t
D
P
Po
E
F
P1
Bo
W
Ko
Ao
D1
Copyright ã ANPEC Electronics Corp.
21
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Rev. B.2 - May., 2005