APL5101/2
Classification Reflow Profiles (Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
Package Thickness
Volume mm3
<350
Volume mm3
350
<2.5 mm
³ 2.5 mm
240 +0/-5°C
225 +0/-5°C
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness
Volume mm3
<350
Volume mm3
350-2000
Volume mm3
>2000
<1.6 mm
1.6 mm – 2.5 mm
³ 2.5 mm
260 +0°C*
260 +0°C*
250 +0°C*
260 +0°C*
250 +0°C*
245 +0°C*
260 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the
stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C)
at the rated MSL level.
Reliability test program
Test item
SOLDERABILITY
H O LT
PCT
TST
Method
M IL-STD-883D-2003
M IL-STD-883D-1005.7
JESD-22-B, A102
M IL-STD-883D-1011.9
M IL-STD-883D-3015.7
JESD 78
Description
245 C , 5 SEC
°
1000 Hrs Bias @ 125 °C
168 Hrs, 100 % RH , 121 °C
-65°C ~ 150°C , 200 Cycles
VHBM > 2KV, VMM > 200V
10ms , Itr > 100mA
ESD
Latch-Up
t
Carrier Tape
D
P
Po
E
F
P1
Bo
W
Ko
Ao
D1
T2
J
C
A
B
T1
Copyright ã ANPEC Electronics Corp.
14
www.anpec.com.tw
Rev. A.1 - Jun., 2005
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
