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XC0900A-20 参数 Datasheet PDF下载

XC0900A-20图片预览
型号: XC0900A-20
PDF下载: 下载PDF文件 查看货源
内容描述: 20分贝定向耦合器 [20 dB Directional Coupler]
分类和应用:
文件页数/大小: 23 页 / 576 K
品牌: ANAREN [ ANAREN MICROWAVE ]
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Model XC0900A-20  
Rev F  
Mounting  
Coupler Mounting Process  
In order for Xinger surface mount couplers to work  
optimally, there must be 50transmission lines leading The process for assembling this component is a  
to and from all of the RF ports. Also, there must be a conventional surface mount process as shown in Figure  
very good ground plane underneath the part to ensure 1. This process is conducive to both low and high volume  
proper electrical performance. If either of these two usage.  
conditions is not satisfied, insertion loss, coupling, VSWR  
and isolation may not meet published specifications.  
Overall ground is improved if a dense population of  
plated through holes connect the top and bottom ground  
layers of the PCB. This minimizes ground inductance  
and improves ground continuity. All of the Xinger hybrid  
Figure 1: Surface Mounting Process Steps  
and directional couplers are constructed from ceramic  
Storage of Components: The Xinger II products are  
filled PTFE composites which possess excellent electrical  
available in either an immersion tin or tin-lead finish.  
and mechanical stability having X and Y thermal  
Commonly used storage procedures used to control  
coefficient of expansion (CTE) of 17-25 ppm/oC.  
oxidation should be followed for these surface mount  
components. The storage temperatures should be held  
between 15OC and 60OC.  
When a surface mount hybrid coupler is mounted to a  
printed circuit board, the primary concerns are; ensuring  
the RF pads of the device are in contact with the circuit  
Substrate: Depending upon the particular component,  
trace of the PCB and insuring the ground plane of neither  
the circuit material has an x and y coefficient of thermal  
the component nor the PCB is in contact with the RF  
expansion of between 17 and 25 ppm/°C. This coefficient  
minimizes solder joint stresses due to similar expansion  
signal.  
rates of most commonly used board substrates such as  
RF35, RO4350, FR4, polyimide and G-10 materials.  
Mounting Footprint  
Mounting to “hard” substrates (alumina etc.) is possible  
To ensure proper electrical and thermal performance  
depending upon operational temperature requirements.  
The solder surfaces of the coupler are all copper plated  
there must be a ground plane with 100%  
solder connection underneath the part  
with either an immersion tin or tin-lead exterior finish.  
Solder Paste: All conventional solder paste formulations  
will work well with Anaren’s Xinger II surface mount  
components. Solder paste can be applied with stencils or  
syringe dispensers. An example of a stenciled solder  
paste deposit is shown in Figure 2. As shown in the  
figure solder paste is applied to the four RF pads and the  
entire ground plane underneath the body of the part.  
.430  
[10.92]  
Multiple  
plated thru holes  
to ground  
4X .040  
[1.02]  
.220  
[5.59]  
4X .066 SQ  
4X 50  
[1.65]  
Transmission  
Line  
Dimensions are in Inches [Millimeters]  
XC0900A-20* Mounting Footprint  
USA/Canada:  
Toll Free:  
(315) 432-8909  
(800) 411-6596  
+44 2392-232392  
Available on Tape  
and Reel for Pick and  
Place Manufacturing.  
Europe: