欢迎访问ic37.com |
会员登录 免费注册
发布采购

B0011E75300A00 参数 Datasheet PDF下载

B0011E75300A00图片预览
型号: B0011E75300A00
PDF下载: 下载PDF文件 查看货源
内容描述: 超薄型1008巴伦 [Ultra Low Profile 1008 Balun]
分类和应用:
文件页数/大小: 10 页 / 488 K
品牌: ANAREN [ ANAREN MICROWAVE ]
 浏览型号B0011E75300A00的Datasheet PDF文件第2页浏览型号B0011E75300A00的Datasheet PDF文件第3页浏览型号B0011E75300A00的Datasheet PDF文件第4页浏览型号B0011E75300A00的Datasheet PDF文件第5页浏览型号B0011E75300A00的Datasheet PDF文件第6页浏览型号B0011E75300A00的Datasheet PDF文件第7页浏览型号B0011E75300A00的Datasheet PDF文件第9页浏览型号B0011E75300A00的Datasheet PDF文件第10页  
Model B0011E75300A00  
Rev B  
Mounting Configuration:  
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be  
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet  
published specifications.  
All of the Xinger components are constructed from softboard composites which possess excellent electrical and  
mechanical stability having X and Y thermal coefficient of expansion (CTE) of 19 ppm/oC.  
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the  
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying  
pick and place equipment tolerances.  
.026 [0.65]  
.018[0.46]  
10X .014  
[0.35]  
3X Transmission  
Line  
Component Top View  
.068  
.026  
[1.73]  
[0.65]  
Circuit Pattern  
.021 [0.54]  
Footprint Pad (s)  
10X .011  
[0.27]  
Solder Resist  
Dimensions are in Inches [Millimeters]  
Mounting Footprint  
The material used for testing is 8mil Rogers 4003. For a ground plane spacing much larger than this the single via at  
pin 5 should be replaced with at least 2 via and if possible a coplanar ground.  
USA/Canada:  
Toll Free:  
Europe:  
(315) 432-8909  
(800) 411-6596  
+44 2392-232392  
Available on Tape and  
Reel for Pick and Place  
Manufacturing.