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AAT2552_08 参数 Datasheet PDF下载

AAT2552_08图片预览
型号: AAT2552_08
PDF下载: 下载PDF文件 查看货源
内容描述: 用于便携式应用的总电源解决方案 [Total Power Solution for Portable Applications]
分类和应用: 便携式
文件页数/大小: 31 页 / 824 K
品牌: ANALOGICTECH [ ADVANCED ANALOGIC TECHNOLOGIES ]
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PRODUCT DATASHEET  
AAT2552178  
SystemPowerTM  
Total Power Solution for Portable Applications  
last resistor should be placed between the LED cathode  
and the STAT pin. LED current consumption will add to  
the overall thermal power budget for the device pack-  
age, hence it is good to keep the LED drive current to a  
minimum. 2mA should be sufficient to drive most low-  
cost green or red LEDs. It is not recommended to exceed  
8mA for driving an individual status LED.  
Figure 3 shows the relationship of maximum power dis-  
sipation and ambient temperature of the AAT2552.  
3.00  
2.50  
2.00  
1.50  
1.00  
0.50  
0.00  
The required ballast resistor values can be estimated  
using the following formulas:  
(VADP  
- VF(LED)  
ILED  
)
R6 =  
0
20  
40  
60  
80  
100  
TA (°°C)  
Example:  
Figure 3: Maximum Power Dissipation.  
(5.5V - 2.0V)  
2mA  
R6 =  
= 1.75kΩ  
Next, the power dissipation of the battery charger can be  
calculated by the following equation:  
Note: Red LED forward voltage (VF) is typically 2.0V @  
2mA.  
PD = [(VADP - VBAT) · ICH + (VADP · IOP)]  
Thermal Considerations  
Where:  
The AAT2552 is offered in a TDFN34-16 package which  
can provide up to 2W of power dissipation when it is  
properly bonded to a printed circuit board and has a  
maximum thermal resistance of 50°C/W. Many consider-  
ations should be taken into account when designing the  
printed circuit board layout, as well as the placement of  
the charger IC package in proximity to other heat gen-  
erating devices in a given application design. The ambi-  
ent temperature around the IC will also have an effect  
on the thermal limits of a battery charging application.  
The maximum limits that can be expected for a given  
ambient condition can be estimated by the following dis-  
cussion.  
PD = Total Power Dissipation by the Device  
VADP = ADP/USB Voltage  
VBAT = Battery Voltage as Seen at the BAT Pin  
ICH = Constant Charge Current Programmed for the  
Application  
IOP = Quiescent Current Consumed by the Charger IC  
for Normal Operation [0.5mA]  
By substitution, we can derive the maximum charge cur-  
rent before reaching the thermal limit condition (thermal  
cycling). The maximum charge current is the key factor  
when designing battery charger applications.  
(PD(MAX)  
-
VIN  
VIN - VBAT  
· IOP)  
First, the maximum power dissipation for a given situa-  
tion should be calculated:  
ICH(MAX)  
=
(TJ(MAX) TA)  
θJA  
VIN - VBAT  
-
-
VIN · IOP  
(TJ(MAX) - TA)  
θJA  
PD(MAX)  
=
ICH(MAX)  
=
In general, the worst condition is the greatest voltage  
drop across the IC, when battery voltage is charged up  
to the preconditioning voltage threshold. Figure 4 shows  
the maximum charge current in different ambient tem-  
peratures.  
Where:  
PD(MAX) = Maximum Power Dissipation (W)  
θJA = Package Thermal Resistance (°C/W)  
TJ(MAX) = Maximum Device Junction Temperature (°C)  
[135°C]  
TA  
= Ambient Temperature (°C)  
w w w . a n a l o g i c t e c h . c o m  
2552.2008.02.1.2  
19  
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