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AAT2552 参数 Datasheet PDF下载

AAT2552图片预览
型号: AAT2552
PDF下载: 下载PDF文件 查看货源
内容描述: 用于便携式应用的总电源解决方案 [Total Power Solution for Portable Applications]
分类和应用: 便携式
文件页数/大小: 33 页 / 1050 K
品牌: ANALOGICTECH [ ADVANCED ANALOGIC TECHNOLOGIES ]
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AAT2552  
Total Power Solution for Portable Applications  
First, the maximum power dissipation for a given  
Event Description  
Status  
OFF  
situation should be calculated:  
No battery charging activity  
Battery charging via adapter  
or USB port  
ON  
(TJ(MAX)  
-
TA)  
PD(MAX)  
=
θJA  
Charging completed  
OFF  
Where:  
PD(MAX) = Maximum Power Dissipation (W)  
θJA = Package Thermal Resistance (°C/W)  
Table 2: LED Status Indicator.  
The LED should be biased with as little current as  
necessary to create reasonable illumination; there-  
fore, a ballast resistor should be placed between  
the LED cathode and the STAT pin. LED current  
consumption will add to the overall thermal power  
budget for the device package, hence it is good to  
keep the LED drive current to a minimum. 2mA  
should be sufficient to drive most low-cost green or  
red LEDs. It is not recommended to exceed 8mA  
for driving an individual status LED.  
TJ(MAX) = Maximum Device Junction Temperature  
(°C) [135°C]  
TA  
= Ambient Temperature (°C)  
Figure 3 shows the relationship of maximum  
power dissipation and ambient temperature of the  
AAT2552.  
The required ballast resistor values can be esti-  
mated using the following formulas:  
3.00  
2.50  
2.00  
1.50  
1.00  
0.50  
0.00  
(VADP  
- VF(LED)  
ILED  
)
R6 =  
Example:  
0
20  
40  
60  
80  
100  
TA (°C)  
(5.5V - 2.0V)  
2mA  
R6 =  
= 1.75kΩ  
Figure 3: Maximum Power Dissipation.  
Next, the power dissipation of the battery charger  
can be calculated by the following equation:  
Note: Red LED forward voltage (VF) is typically  
2.0V @ 2mA.  
Thermal Considerations  
PD = [(VADP - VBAT) · ICH + (VADP · IOP)]  
The AAT2552 is offered in a TDFN34-16 package  
which can provide up to 2W of power dissipation  
when it is properly bonded to a printed circuit board  
and has a maximum thermal resistance of 50°C/W.  
Many considerations should be taken into account  
when designing the printed circuit board layout, as  
well as the placement of the charger IC package in  
proximity to other heat generating devices in a given  
application design. The ambient temperature around  
the IC will also have an effect on the thermal limits of  
a battery charging application. The maximum limits  
that can be expected for a given ambient condition  
can be estimated by the following discussion.  
Where:  
PD  
= Total Power Dissipation by the Device  
VADP = ADP/USB Voltage  
VBAT = Battery Voltage as Seen at the BAT Pin  
ICH = Constant Charge Current Programmed for  
the Application  
IOP = Quiescent Current Consumed by the  
Charger IC for Normal Operation [0.5mA]  
20  
2552.2007.04.1.0  
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