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AAT1171IWP-1-T1 参数 Datasheet PDF下载

AAT1171IWP-1-T1图片预览
型号: AAT1171IWP-1-T1
PDF下载: 下载PDF文件 查看货源
内容描述: 600毫安电压缩放降压转换器,用于RF功率放大器,带有旁路开关 [600mA Voltage-Scaling Step-Down Converter for RF Power Amplifiers with Bypass Switch]
分类和应用: 转换器开关放大器功率放大器
文件页数/大小: 22 页 / 791 K
品牌: ANALOGICTECH [ ADVANCED ANALOGIC TECHNOLOGIES ]
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AAT1171  
600mA Voltage-Scaling Step-Down Converter  
for RF Power Amplifiers with Bypass Switch  
For the condition where the buck converter is at  
100% duty cycle dropout, the total device dissipa-  
tion reduces to:  
Layout  
The suggested PCB layout for the AAT1171 is  
shown in Figures 3 and 4. The following guidelines  
should be used to ensure a proper layout.  
PTOTAL = IO2 · RDS(ON) + IQ · VIN  
1. The input capacitor (C1) should connect as  
closely as possible to VIN (Pin 10) and PGND  
(Pin 11).  
2. C2 and L1 should be connected as closely as  
possible. The connection of L1 to the LX pin  
should be as short as possible.  
3. The PCB trace connected to VOUT (Pins 2 and  
3) is tied to the bypass path, as well as the feed-  
back path for the control loop. In bypass mode,  
the full load current is delivered directly from the  
battery input; therefore, this trace should be suf-  
ficient to handle current up to the bypass current  
limit level.  
In bypass mode, the bypass MOSFET RDS(ON)(bp) is  
used to determine the losses. The power MOSFET  
RDS(ON) increases with decreasing input voltage  
and the associated losses are a maximum at the  
minimum input voltage (2.7V).  
PTOTAL = IO2 · RDS(ON)(bp) + IQ · VIN  
4. The resistance of the trace from the load return  
to PGND (Pin 11) should be kept to a minimum.  
This minimizes any error in DC regulation due to  
differences in the potential of the internal signal  
ground and the power ground.  
Since the RDS(ON), quiescent current, and switching  
losses all vary with input voltage, the total losses  
should be investigated over the complete input  
voltage range.  
5. For good thermal coupling, PCB vias are required  
from the pad for the TDFN exposed paddle to the  
ground plane. The via diameter should be 0.3mm  
to 0.33mm and positioned on a 1.2mm grid.  
After calculating the total losses, the maximum  
junction temperature can be derived from the θJA  
for the TDFN33-12 package which is typically  
50°C/W.  
TJ(MAX)  
=
PTOTAL  
·
Θ
JA + TAMB  
Figure 3: AAT1171 Evaluation Board  
Top Side Layout.  
Figure 4: AAT1171 Evaluation Board  
Bottom Side Layout.  
18  
1171.2006.06.1.0  
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