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AAT1160 参数 Datasheet PDF下载

AAT1160图片预览
型号: AAT1160
PDF下载: 下载PDF文件 查看货源
内容描述: 12V , 3A降压型DC / DC转换器 [12V, 3A Step-Down DC/DC Converter]
分类和应用: 转换器
文件页数/大小: 17 页 / 656 K
品牌: ANALOGICTECH [ ADVANCED ANALOGIC TECHNOLOGIES ]
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PRODUCT DATASHEET  
AAT1160  
SwitchRegTM  
12V, 3A Step-Down DC/DC Converter  
the load current demand. The relationship of the output  
voltage droop during the three switching cycles to the  
output capacitance can be estimated by:  
FOSC is the switching frequency and COUT is based on the  
output capacitor calculation. The CCOMP value can be  
determined from the following equation:  
4
CCOMP (C7) =  
3 · ΔILOAD  
DROOP · FOSC  
COUT  
=
FOSC  
V
2πRCOMP (R5) ·  
10 ⎠  
Layout Guidance  
Once the average inductor current increases to the DC  
load level, the output voltage recovers. The above equa-  
tion establishes a limit on the minimum value for the  
output capacitor with respect to load transients. The  
internal voltage loop compensation also limits the mini-  
mum output capacitor value to 22F. This is due to its  
effect on the loop crossover frequency (bandwidth),  
phase margin, and gain margin. Increased output capac-  
itance will reduce the crossover frequency with greater  
phase margin.  
Figure 2 is the schematic for the evaluation board. When  
laying out the PC board, the following layout guideline  
should be followed to ensure proper operation of the  
AAT1160:  
1. Exposed pad EP1 must be reliably soldered to PGND/  
DGND/AGND. The exposed thermal pad should be  
connected to board ground plane and pins 6, 11, 13,  
and 16. The ground plane should include a large  
exposed copper pad under the package for thermal  
dissipation.  
2. The power traces, including GND traces, the LX  
traces and the VIN trace should be kept short, direct  
and wide to allow large current flow. The L1 connec-  
tion to the LX pins should be as short as possible.  
Use several via pads when routing between layers.  
3. Exposed pad pin EP2 must be reliably soldered to  
the LX pins 1 and 2. The exposed thermal pad  
should be connected to the board LX connection and  
the inductor L1 and also pins 1 and 2. The LX plane  
should include a large exposed copper pad under the  
package for thermal dissipation.  
The maximum output capacitor RMS ripple current is  
given by:  
1
V
OUT · (VIN(MAX) - VOUT  
)
IRMS(MAX)  
=
·
L · FOSC · VIN(MAX)  
2 · 3  
Dissipation due to the RMS current in the ceramic output  
capacitor ESR is typically minimal, resulting in less than  
a few degrees rise in hot-spot temperature.  
Compensation  
4. The input capacitors (C2 and C6) should be con-  
nected as close as possible to IN (Pins 4 and 5) and  
DGND (Pin 6) to get good power filtering.  
5. Keep the switching node LX away from the sensitive  
FB node.  
6. The feedback trace for the FB pin should be separate  
from any power trace and connected as closely as  
possible to the load point. Sensing along a high-  
current load trace will degrade DC load regulation.  
The feedback resistors should be placed as close as  
possible to the FB pin (Pin 9) to minimize the length  
of the high impedance feedback trace.  
7. The output capacitors C3, 4, and 5 and L1 should be  
connected as close as possible and there should not  
be any signal lines under the inductor.  
The AAT1160 step-down converter uses peak current  
mode control with slope compensation scheme to main-  
tain stability with lower value inductors for duty cycles  
greater than 50%. The regulation feedback loop in the  
IC is stabilized by the components connected to the  
COMP pin, as shown in Figure 1.  
To optimize the compensation components, the following  
equations can be used. The compensation resistor RCOMP  
(R5) is calculated using the following equation:  
2πVOUT · COUT  
10GEA · GCOMP · VFB  
·
FOSC  
RCOMP (R5)=  
Where VFB = 0.6V, GCOMP = 40.1734 and GEA = 9.091 ·  
10-5.  
8. The resistance of the trace from the load return to  
the PGND (Pin 16) should be kept to a minimum.  
This will help to minimize any error in DC regulation  
due to differences in the potential of the internal  
signal ground and the power ground.  
w w w . a n a l o g i c t e c h . c o m  
1160.2007.11.1.1  
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