AWS5524
1425
306
736
RFC
RF1
1075
1150
75
RF4
907
RF4G
RF1G
850
1225
671
V4
V1
596
546
V3
V2
310
RF3G
371
RF3
VS
RF2
RF2G
75
1036
306
735
1500
Bondpads 100 x 75µm
Dimensions in µm
Dimensions in µm
Bond Pads: 100 µm x 75 µm
Die Thickness: 178 µm
Figure 2: Die Configuration
Table 1: Pad Description
NAME
RF1
RFG1
V1
V2
RFG2
RF2
VS
DESCRIPTION
RF port, path 1
Ground
Control voltage, RF path 1
Control voltage, RF path 2
Ground
RF port, path 2
Common port bias
voltage (logic high)
NAME
RF3
RFG3
V3
V4
RF4G
RF4
RFC
DESCRIPTION
RF port, path 3
Ground
Control voltage, RF path 3
Control voltage, RF path 4
Ground
RF port, path 4
RF common port
2
ADVANCED PRODUCT INFORMATION - Rev 0.1
12/2002
1333
ANADIGICS [ ANADIGICS, INC ]
