ATA01501D1C/ATA01501S2C
ATA01501D1C Die Bonding Pads
ATA01501D1C Die Typical Bonding
VDD
VDD2
56pF
56pF
VDD1
GND
GND
1992
GND
VDD2
VDD
GND
GND
1992
VOUT
I
19
IIN
925 um
19 I
PIN
IIN
GND
OUT
VOUT
GND
GND
BY
BY
GND
GND
C
C
CAGC
GND
GND
GND
CAGC
CBY
CBY
GND
GND
GND
GND
56pF
56pF
1250 um
ATA01501DS2C SQFP Package Outline
0.245 (6.22)
0.230 (5.84)
0.065 (1.65)
0.055 (1.40)
PIN NO.
FUNCTION
NC
0.165 (4.19)
0.152 (3.86)
7°
1
2
0o
0.047 (1.19)
0.032 (0.81)
0.035 (.89)
0.020 (.51)
GND
11
10
12
3
I
0.018 (.460)
0.012 (.300)
IN
4
CBY
GND
CAGC
VOUT
GND
NC
0.021X45°
4 Sides
1
2
3
9
5
8
6
7
7
8
0.015 (.38)
0.000 (0.00)
0.000 (0.00)
0.020 (.51)
4
9
5
6
4X 0.023X45°
10
11
12
VDD
0.024 (.61)
0.018 (.46)
0.011 (.28)
0.007 (.18)
GND
NC
0.032 BSC
(0.81)
ATA01501DS2C Typical SQFP Connection Package
VDD
0.1µF
NC
12
11
10
NC
1
2
NC
9
8
0.1µF
Vout
IIN
7
3
GND
or
4
5
6
Neg.Supply
56 pF
56 pF
3
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