ADA10001
PACKAGE OUTLINE
D
C
LE
E
H
L
0.015 [0.38]X45
A
2
A
A
1
GAUGE PLANE
0.003 [0.076mm]
SEATING PLANE
e
B
1
B
S
INCHES
MILLIMETERS
NOTES:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH,
Y
M
NOTE
B
O
L
MIN.
MAX.
MIN.
MAX.
0.058
0.068
1.47
1.73
A
0.004
0.055
0.013
0.062
0.008
0.380
0.150
0.010
0.065
0.020
0.070
0.010
0.400
0.160
0.10
1.40
0.33
1.58
0.20
9.66
3.81
0.25
1.65
0.50
1.78
0.25
10.16
4.06
PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS
AND GATE BURRS SHALL NOT EXCEED 0.006 [0.15mm]
PER SIDE.
A1
A2
B
3. DIMENSION "E" DOES NOT INCLUDE INTER-LEAD FLASH OR
PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.010 [0.25mm] PER SIDE.
B
1
C
4
2
3
4. LEAD THICKNESS AFTER PLATING TO BE 0.013 [0.33mm]
MAXIMUM.
D
E
e
0.050 BSC
1.27 BSC
SPECIFICATION: 98000-006
0.226
0.016
0.030
0.244
0.040
5.74
0.41
0.76
6.20
1.02
H
L
SUBJECT: PUBLISHED OUTLINE,
16 LEAD BATWING SOIC PKG.
LE
a
0
8
0
8
Figure 10: S3 Package Outline - Modified 16 Pin SOIC
Data Sheet - Rev 2.3
02/2005
7
ANADIGICS [ ANADIGICS, INC ]
