AS1702 - AS1705
Data Sheet
- A b s o l u t e
Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 3
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Supply Voltage (V
CC
to GND)
Any Other Pin to GND
Input Current (Latchup Immunity)
Continuous Power Dissipation
(T
AMB
= +70ºC)
(T
AMB
= +25ºC)
†
Min
-0.3
-0.3
-50
Max
+7
V
CC
+ 0.3
50
600
1,000
1
Unit
V
V
mA
mW
mW
kV
ºC
ºC
Comments
JEDEC 17
MSOP-10
MSOP-10
Human Body Model
and
MIL-Std883E
3015.7
methods
Continuous Power Dissipation
†
Electro-Static Discharge (ESD)
Operating Temperature Range
(T
AMB
)
Storage Temperature Range
-40
-65
+85
+150
Package Body Temperature
+260
ºC
The reflow peak soldering temperature
(body temperature) specified is in
accordance with
IPC/JEDEC J-STD-020C
“Moisture/Reflow Sensitivity Classification
for Non-Hermetic Solid State Surface Mount
Devices”
†
Using PCB metal plane and thermally-conductive paste.
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