AS1538/AS1540
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
+VDD to GND
-0.3
+6
V
+VDD+
0.3
Digital Input Voltage to GND
-0.3
V
100
+85
°C/W
ºC
on PCB
Thermal Resistance θJA
Operating Temperature Range
Storage Temperature Range
Junction Temperature (TJMAX)
ESD
-40
-65
+150
150
ºC
ºC
1.5
kV
HBM MIL-Std. 883E 3015.7 methods
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Package Body Temperature
+260
ºC
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