AS1371
Datasheet - Detailed Description
Operating Region and Power Dissipation
Maximum power dissipation is determined by the thermal resistance of the case and circuit board, the temperature
difference between the die junction and ambient air, and the rate of air flow. The power dissipation of the device is
calculated by:
P = IOUT × (VIN – VOUT
)
(EQ 2)
Maximum power dissipation is calculated by:
TJ – TAMB
------------------------
=
PMAX
(EQ 3)
θ
JB + θJA
Where:
TJ - TAMB is the temperature difference between the device die junction and the surrounding air.
JB is the thermal resistance of the package.
JA is the thermal resistance through the circuit board, copper traces, and other materials to the surrounding.
θ
θ
Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin
should be connected to the system ground using a large pad or a ground plane.
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