AS1376
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 2
may cause permanent damage to the device. These are stress ratings only and functional operation of
the device at these or any other conditions beyond those indicated in
Section 6 Electrical Characteristics on page 4
is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
VIN to GND
VBIAS,
EN
to GND
VOUT to GND
Output Short-Circuit Duration
Input Current (latch-up immunity)
Electrostatic Discharge
Electrostatic Discharge HBM
2
kV
Temperature Ranges and Storage Conditions
-100
-0.3
-0.3
-0.3
5
+6.5
V
IN
+ 0.3
Indefinite
100
mA
V
V
V
JEDEC 78
Min
Max
Units
Notes
Te
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Thermal Resistance
JA
97
ºC/W
Junction Temperature
+125
+150
85
ºC
ºC
%
Storage Temperature Range
Humidity non-condensing
-55
5
Package Body Temperature
+260
ºC
Humidity non-condensing
5
85
%
Revision 1.4
Norm: MIL 883 E method 3015
Junction-to-ambient thermal resistance is very
dependent on application and board-layout. In
situations where high maximum power
dissipation exists, special attention must be paid
to thermal dissipation during board design.
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
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