AS1375
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The device is available in a 6-pin TDFN 2x2mm package.
Figure 9. 6-pin TDFN 2x2mm Package Diagram
D
A
D/2
INDEX AREA
D/2 x E/2
B
INDEX AREA
(D/2 x E/2)
PIN#1 ID
E/2
D2
e
Terminal Tip
aaa C
0.08 C
Table 4. 4-bumps WL-CSP package Dimensions
Symbol
Min
Typ
A
0.51
0.55
A1
0.00
0.02
A3
0.15 REF
0.20
0.25
b
0.50
e
aaa
0.15
bbb
0.10
ccc
0.10
Note:
hn
ic a
al m
co s
A
nt G
en
ts
til
aaa C
bbb
b
C A B
TOP VIEW
BOTTOM VIEW
A3
ccc C
A
B
SEATING
PLANE
SIDE VIEW
A1
Max
0.60
0.05
0.32
Symbol
D BSC
E BSC
D2
E2
L
k
ND
N
Min
1.95
1.95
1.30
0.85
0.15
0.20
Te
c
1. All dimensions are in millimeters, angle is in degrees (°).
2. N is the total number of terminals.
3. The location of the terminal #1 identifier and terminal numbering convention conforms to JEDEC publication 95
SPP-002.
4. ND and NE refer to the number of terminals on each D and E side respectively.
5. NJR refer to non jedec registered.
6. Dimension b applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal
tip. If the terminal has the optional radius on the other end of the terminal, the dimension B should not be mea-
sured in that radius area.
7. Coplanarity applies to the terminals and all other bottom surface metallization.
Revision 1.02
lv
EXPOSED PAD
Typ
2.00
2.00
1.45
1.00
0.25
3
6
al
Max
2.05
2.05
1.55
1.10
0.35
8 - 10
E
id
L
AMSCO [ AUSTRIAMICROSYSTEMS AG ]
