AS1374
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 2
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
Electrical Characteristics on page 4
is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
VDD to GND
All other pins to GND
Output Short-Circuit Duration
Input Current (latch-up immunity)
Electrostatic Discharge
Electrostatic Discharge HBM
Temperature Ranges and Storage Conditions
Thermal Resistance
JA
2
kV
-100
-0.3
-0.3
7
V
DD
+ 0.3
Infinite
100
mA
V
V
Min
Max
Units
Comments
Norm: MIL 883 E method 3015
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201.7
ºC/W
Junction Temperature
+125
ºC
Storage Temperature Range
-55
+150
ºC
Package Body Temperature
+260
85
ºC
Humidity non-condensing
5
%
Revision 1.8
Junction-to-ambient thermal resistance is very
dependent on application and board-layout. In
situations where high maximum power dissipation
exists, special attention must be paid to thermal
dissipation during board design.
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
lv
3 - 18
Norm: JEDEC 78
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