AS1374
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
Min
Max
Units
Comments
VDD to GND
-0.3
-0.3
7
V
V
All other pins to GND
VDD + 0.3
Infinite
100
Output Short-Circuit Duration
Input Current (latch-up immunity)
-100
mA
kV
Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge HBM
2
Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
Junction-to-ambient thermal resistance is very
dependent on application and board-layout. In
situations where high maximum power dissipation
exists, special attention must be paid to thermal
dissipation during board design.
Thermal Resistance JA
201.7
ºC/W
Junction Temperature
+125
+150
ºC
ºC
Storage Temperature Range
-55
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
Package Body Temperature
Humidity non-condensing
ºC
%
+260
85
5
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