AS1369
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 2
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
Electrical Characteristics on page 4
is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
Input Supply Voltage
Shutdown Input Voltage
Output Voltage
I
OUT
Input/Output Voltage
Latch-Up
Electrostatic Discharge
2
1
Min
-0.3
-0.3
-0.3
-0.3
-100
Max
+7
+7
+7
+7
+100
2
Units
V
V
V
Comments
V
mA
kV
V
Norm: JEDEC 78
Temperature Ranges and Storage Conditions
Operating Junction Temperature
Storage Temperature Range
Package Body Temperature
1. The AS1369 uses an internal protective structure against light influence. However, exposing the WLP package to direct light could
cause device malfunction.
2. The output PNP structure contains a diode between pins V
IN
and V
OUT
that is normally reverse-biased. reversing the polarity of pins
V
IN
and V
OUT
will activate this diode.
3. Exceeding the maximum allowable dissipation will cause excessive device temperature and the regulator will go into thermal shutdown.
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Norm: MIL 883 E method 3015
500
CDM JESD22-C101C methods
Thermal Resistance,
JA
3
345
ºC/W
The maximum allowable power dissipation is a function of the
maximum junction temperature (T
J(MAX
), the junction-to-
ambient thermal resistance (
JA
), and the ambient
temperature (T
AMB
). The maximum allowable power
dissipation at any ambient temperature is calculated as:
(EQ 1)
P
(MAX)
= (T
J(MAX)
- (T
AMB
))/
JA
Where:
The value of
JA
for the WLP package is 345°C/W.
-40
+125
ºC
-65
+150
ºC
+260
ºC
The reflow peak soldering temperature (body temperature)
specified is in accordance with
IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
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