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AS1359-BTTT-31 参数 Datasheet PDF下载

AS1359-BTTT-31图片预览
型号: AS1359-BTTT-31
PDF下载: 下载PDF文件 查看货源
内容描述: 150毫安/ 300毫安,超低噪声,高PSRR低压降稳压器 [150mA/300mA, Ultra-Low-Noise, High-PSRR Low Dropout Regulators]
分类和应用: 稳压器
文件页数/大小: 14 页 / 715 K
品牌: AMSCO [ AMS(艾迈斯) ]
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AS1358/AS1359  
Datasheet - Detailed Description  
Current Limit  
The AS1358/AS1359 include a current limiting circuitry to monitor and control the P-channel MOSFET pass transis-  
tor’s gate voltage, thus limiting the device output current to 270mA (AS1358) and 510mA (AS1359).  
Note: See Table 4 on page 4 for the recommended min and max current limits. The output can be shorted to ground  
indefinitely without causing damage to the device.  
Thermal Protection  
Integrated thermal protection circuitry limits total power dissipation in the AS1358/AS1359. When the junction temper-  
ature (TJ) exceeds +160ºC, the thermal sensor signals the shutdown logic, turning off the P-channel MOSFET pass  
transistor and allowing the device to cool down. The thermal sensor turns the pass transistor on again after the  
device’s junction temperature drops by 10ºC, resulting in a pulsed output during continuous thermal-overload condi-  
tions.  
Note: Thermal protection is designed to protect the devices in the event of fault conditions. For continuous operation,  
do not exceed the absolute maximum junction temperature rating of +150ºC.  
Operating Region and Power Dissipation  
The AS1358/AS1359 maximum power dissipation is dependant on the thermal resistance of the case and PCB, the  
temperature difference between the die junction and TAMB, and airflow rate.  
Power dissipation across the device is calculated as:  
PD = IOUT (VIN - VOUT)  
The maximum power dissipation is calculated:  
PDMAX = (TJ - TAMB)/(θJC + θCA)  
(EQ 1)  
(EQ 2)  
Where:  
TJ - TAMB is the temperature difference between the AS1358/AS1359 die junction and the surrounding air;  
θJC is the thermal resistance of the package;  
θCA is the thermal resistance through the PC board/copper traces/other materials to the surrounding air.  
Note: Pin GND of the AS1358/AS1359 provides the electrical connection to system ground and also serves as a heat  
sink. Connect pin GND to the system ground using a large pad or ground plane.  
Noise Reduction  
The AS1358/AS1359 noise bypass circuitry dramatically reduces output noise, exhibiting 9µVRMS of output voltage  
noise with CBYPASS = 0.01µF and COUT = 1µF. Use an external 0.01µF bypass capacitor between pin BYPASS and pin  
OUT (see Figure 1 on page 1).  
Note: Startup time is minimized by internal power-on circuitry which pre-charges CBYPASS.  
www.austriamicrosystems.com  
Revision 1.04  
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