AS1358/AS1359
Datasheet - Package Drawings and Markings
10 Package Drawings and Markings
The devices are available in a TSOT23 5-pin package.
Figure 19. TSOT23 5-pin Package
Symbol
Min
Typ
Max
1.00
0.10
0.90
0.45
0.39
0.20
Notes
Symbol
Min
Typ
0.40
Max
Notes
A
A1
A2
b
L
L1
L2
N
0.30
0.50
0.01
0.84
0.30
0.31
0.12
0.05
0.87
0.60REF
0.25BSC
5
b1
c
0.35
0.15
R
0.10
0.10
R1
0.25
8º
c1
0.08
0.13
0.16
0º
4º
4º
θ
θ1
D
E
2.90BSC
2.80BSC
1.60BSC
0.95BSC
1.90BSC
3,4
3,4
3,4
10º
12º
Tolerances of Form and Position
E1
e
aaa
bbb
ccc
ddd
0.15
0.25
0.10
0.20
e1
Notes:
1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994.
2. Dimensions are in millimeters.
3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall
not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or pro-
trusion shall not exceed 0.15mm per side. Dimensions D and E1 are determined at datum H.
4. The package top can be smaller than the package bottom. Dimensions D and E1 are determined at the outer-
most extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
include any mistmatches between the top of the package body and the bottom. D and E1 are determined at
datum H.
www.austriamicrosystems.com
Revision 1.04
12 - 14
AMSCO [ AMS(艾迈斯) ]
