AS1357
Data Sheet
- Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sec-
tions of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
V
DD
to GND
Any other pin to GND
Continuous Power Dissipation
QFN12 4x4mm
Package-Body Peak
Temperature
Operating Temperature
Storage Temperature
Electrostatic Discharge
Protection (ESD) Level
-40
-65
1
Min
-0.3
-0.3
1100
Max
7
V
DD
+ 0.3
2800
Units
V
V
mW
Min value measured at T
AMB
= 85°C;
max value measured at T
AMB
= 25°C.
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for non-hermetic
Solid State Surface Mount Devices”.
Comments
260
°C
85
150
°C
°C
kV
HBM – Norm:
MIL 883 E method 3015.
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