AS1351
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sec-
tions of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
VDD to GND
Min
-0.3
-0.3
Max
7
Units
Comments
V
V
Any other pin to GND
VDD + 0.3
Continuous Power Dissipation
QFN12 3x3mm
Min value measured at TAMB = 85°C;
max value measured at TAMB = 25°C.
590
1500
260
mW
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for non-hermetic
Solid State Surface Mount Devices”.
Package-Body Peak
Temperature
°C
Operating Ambient
Temperature
-40
-65
1
85
°C
°C
kV
Storage Temperature
150
Electrostatic Discharge
Protection (ESD) Level
HBM – Norm: MIL 883 E method 3015.
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