AS1358 / AS1359
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 3
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
Electrical Characteristics on page 4
is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
IN to GND
OUT, SHDNN to GND
BYPASS to GND
Output Short-Circuit Duration
Thermal Resistance
JA
Operating Temperature Range
Junction Temperature
Storage Temperature Range
-40
Min
-0.3
-0.3
-0.3
Max
+7
IN +0.3
OUT +0.3
Infinite
201.7
+85
ºC/W
ºC
Units
V
V
V
Comments
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+125
ºC
ºC
-65
+150
Package Body Temperature
+260
ºC
Revision 1.5
The reflow peak soldering temperature (body temperature)
specified is in accordance with
IPC/JEDEC J-STD-020D
“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
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Junction-to-ambient thermal resistance is very dependent
on application and board-layout. In situations where high
maximum power dissipation exists, special attention must
be paid to thermal dissipation during board design.
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