AS1358 / AS1359
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
IN to GND
Min
-0.3
-0.3
-0.3
Max
+7
Units
Comments
V
V
V
OUT, SHDNN to GND
BYPASS to GND
IN +0.3
OUT +0.3
Infinite
Output Short-Circuit Duration
Junction-to-ambient thermal resistance is very dependent
on application and board-layout. In situations where high
maximum power dissipation exists, special attention must
be paid to thermal dissipation during board design.
Thermal Resistance JA
201.7
ºC/W
Operating Temperature Range
Junction Temperature
-40
-65
+85
+125
+150
ºC
ºC
ºC
Storage Temperature Range
The reflow peak soldering temperature (body temperature)
specified is in accordance with IPC/JEDEC J-STD-020D
“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Package Body Temperature
+260
ºC
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