AS1353/AS1356
Data Sheet
- A b s o l u t e
Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
affect device reliability.
Table 3. Absolute Maximum Ratings
IN, SHDNM to GND
SHDNM to IN
POK, BP, OUT to GND
Output Short-Circuit Duration
Continuous Power Dissipation
(T
AMB
= +70ºC)
Operating Temperature Range
Junction Temperature
Θ
JA
-40
-7
-7
-0.3
Indefinite
571
+85
+7
+0.3
V
IN
+
+0.3
V
V
V
V
mW
ºC
Derate 7.1mW/ºC above +70ºC
Storage Temperature Range
Package Body Temperature
Te
c
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+150
ºC
Internally limited
+140
ºC/W
ºC
-65
+150
+260
ºC
Revision 1.03
The reflow peak soldering temperature
(body temperature) specified is in
accordance with
IPC/JEDEC J-STD-020C
“Moisture/Reflow Sensitivity Classification
for non-hermetic Solid State Surface
Mount Devices”
lv
3 - 13
al
id
Parameter
Min
Max
Typ
Units
Comments