AS1341
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
Min
Max
Units
Comments
IN to GND
LX to GND
-0.3
-2
+23
V
V
V
V
A
V
IN
+ 0.3
FB to GND
-0.3
-0.3
+5
V
IN
+ 0.3
ILIMIT, SHDNN, OUT, POK to GND
Peak Input Current
Temperature Ranges and Storage Conditions
Thermal Resistance ΘJA
2
36.3
+150
+150
ºC/W
ºC
on PCB
Storage Temperature Range
-55
Junction Temperature
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
Package Body Temperature
+260
85
ºC
%
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Humidity non-condensing
Moisture Sensitive Level
5
1
Represents a max. floor life time of unlimited
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