AS1337
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
VIN to GND
Min
-0.3
-0.3
-0.3
-40
Max
5.5
5
Units
V
Notes
FB to GND
V
All other pins to GND
Operating Temperature Range
Storage Temperature Range
6
V
+85
+125
ºC
ºC
-65
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-
020D “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”.
Package Body Temperature
+260
100
ºC
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
Latch-Up
-100
mA
kV
@85°C, JEDEC 78
Human Body Model
2
HBM MIL-Std. 883E 3015.7 methods
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