AS1334
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
VDD, PVIN to SGND
PGND to SGND
POK, EN, FB
Min
-0.3
-0.3
Max
+7.0
+0.3
Units
V
Notes
V
SGND - 0.3 VDD + 0.3
PGND - 0.3 PVIN + 0.3
V
7.0V max
SW
V
PVIN to VDD
-0.3
-40
+0.3
+85
V
Operating Temperature Range
°C
ºC
ºC
Junction Temperature (TJ-MAX
)
+150
+150
Storage Temperature Range
-65
Maximum Lead Temperature
(Soldering, 10 sec)
+260
ºC
ESD Rating
Human Body Model
Operating Ratings
2
kV
HBM MIL-Std. 883E 3015.7 methods
Input Voltage Range
2.7
-40
5.5
650
V
Recommended Load Current
mA
ºC
Junction Temperature (TJ) Range
+125
In applications where high power
dissipation and/or poor package thermal
resistance is present, the maximum
ambient temperature may have to be
derated.
Maximum ambient temperature (TA-MAX
is dependent on the maximum operating
junction temperature (TJ-MAX-OP
125ºC), the maximum power dissipation
of the device in the application (PD-MAX),
and the junction-to ambient thermal
resistance of the part/package in the
application (θJA), as given by the
following
)
=
Ambient Temperature (TA) Range
-40
+85
ºC
equation: TA-MAX = TJ-MAX-OP – (θJA
×
PD-MAX).
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