AS1326
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
ON, ONN, OUT, CLK/SEL to GND
PGND to GND
Min
-0.3
-0.3
Max
7
Units
Comments
V
V
+0.3
VOUT +
0.3
REF, FB, ISET, POUT to GND
LX to PGND
-0.3
V
V
VPOUT +
0.3
-0.3
-0.3
POUT to OUT
+0.3
33
V
ºC/W
ºC
Thermal Resistance ΘJA
Operating Temperature Range
Storage Temperature Range
Junction Temperature
on PCB
-40
-65
+85
+150
+150
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
Package Body Temperature
+260
ºC
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
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