AS1324
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 3
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
Section 6 Electrical Characteristics on page 4
is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
VIN to GND
SW, EN, FB to GND
Thermal Resistance
Θ
JA
ESD
Latch-Up
Operating Temperature Range
Storage Temperature Range
-100
-40
-65
2
+100
+85
+125
Min
-0.3
-0.3
Max
6
V
IN
+ 0.3
207.4
Units
V
V
ºC/W
kV
mA
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Junction temperature (T
J
) is calculated from the
ambient temperature (T
AMB
) and power dissipation
(PD) as:
T
J
= T
AMB
+ (PD)(207.4ºC/W)
Moisture Sensitive Level
1
Represents an unlimited floor life time
(EQ 1)
on PCB
HBM MIL-Std. 883E 3015.7
methods
JEDEC 78
Comments
Package Body Temperature
+260
ºC
Junction Temperature
125
ºC
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