AS1312
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
Min
Max
Units
Comments
VIN, VOUT, EN, LBI, LBO to GND
LX, REF to GND
-0.3
-0.3
-100
+7
V
V
V
OUT + 0.3
Input Current (latch-up immunity)
100
mA
Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge HBM
Temperature Ranges and Storage Conditions
TDFN
±2
kV
Norm: MIL 883 E method 3015
60
97
Junction-to-ambient thermal resistance is very
dependent on application and board-layout. In
situations where high maximum power dissipation
exists, special attention must be paid to thermal
dissipation during board design.
Thermal Resistance θJA
ºC/W
WL-CSP
Junction Temperature
+125
+150
+125
ºC
ºC
ºC
-55
-55
for 8-pin (2x2) TDFN
for 8-pin WL-CSP
Storage Temperature Range
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
Package Body Temperature
+260
85
ºC
%
The lead finish for Pb-free leaded packages is matte
tin (100% Sn).
Humidity non-condensing
Moisture Sensitive Level
5
1
Represents a maximum floor life time of unlimited
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