AS1302
Datasheet - Package Drawings and Markings
10 Package Drawings and Markings
The device is available in a TDFN (3x3x0.8mm) 10-pin and WL-CSP 8-bumps package.
Figure 37. TDFN (3x3x0.8mm) 10-pin Package Diagram
D2
D
SEE
D2/2
DETAIL B
B
L
PIN 1 INDEX AREA
(D/2 xE/2)
K
B
N N-1
b
PIN 1 INDEX AREA
(D/2 xE/2)
aaa
C
2x
TOP VIEW
e
bbb
C A
(ND-1) X e
BTM VIEW
ddd
C
e
Terminal Tip
DETAIL B
ccc
C
C
C
SEATING
PLANE
0.08
SIDE VIEW
DatumA or B
ODD TERMINAL SIDE
Table 6. TDFN (3x3x0.8mm) 10-pin Package Dimensions
Symbol
A
Min
0.70
0.00
Typ
0.75
0.02
Max
0.80
0.05
Symbol
D BSC
E BSC
Min
Typ
3.00
3.00
Max
A1
2.20
1.40
0.30
0º
0.20
0.18
A3
L1
L2
aaa
bbb
ccc
ddd
eee
ggg
0.20 REF
D2
E2
L
θ
k
b
e
N
ND
2.70
1.75
0.50
0.03
0.15
0.13
0.40
0.15
0.10
0.10
0.05
0.08
0.10
0.25
0.50
10
0.30
5
Note:
1. Figure 37 is shown for illustration only.
2. N is the total number of terminals.
3. All dimensions are in millimeters, angle is in degrees.
4. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
www.austriamicrosystems.com/DC-DC_Step-Up/AS1302
Revision 1.03
15 - 18
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