AS1154
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
VCC to GND
INx to GND
OUTx+, OUTx- to GND
Short Circuit Duration (OUTx+, OUTx-)
Electrostatic Discharge
Electrostatic Discharge HBM
Continous Power Dissipation (T
A
= +70°C)
Continous Power Dissipation
Continous Power Dissipation Derating Factor
Temperature Ranges and Storage Conditions
Junction Temperature
Storage Temperature Range
-55
+150
+125
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Represents a max. floor life time of unlimited
755
9.4
mW
mW / °C
P
T
1
for 8-pin SOIC Package
P
DERATE
2
+/- 4
kV
Norm: MIL 883 E method 3015, INx, OUTx+, OUTx-
-0.3
-0.3
-0.3
5.0
Vcc + 0.3
5.0
V
V
V
Min
Max
Units
Comments
Continuous
Package Body Temperature
+260
ºC
Humidity non-condensing
Moisture Sensitive Level
5
1
85
%
1. Depending on actual PCB layout and PCB used.
2. P
DERATE
derating factor changes the total continuous power dissipation (P
T
) if the ambient temperature is not 70ºC. Therefore for e.g.
T
A
=85ºC calculate P
T
at 85ºC = P
T
- P
DERATE
x (85ºC - 70ºC)
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