Data Sheet AS1100
Absolute Maximum Ratings
Voltage (with respect to GND)
VDD
-0.3V to 6V
DIN, CLK, LOAD
All Other Pins
-0.3V to 6V
-0.3V to (VDD +0.3V)
Current
DIG0–DIG7 Sink Current
SEGA–G, DP Source Current
500mA
100mA
Continuous Power Dissipation (TA = +85°C)
Narrow Plastic DIP (derate 13.3mW/°C above
+70°C
1066mW
941mW
Wide SO (derate 11.8mW/°C above +70°C)
Operating Temperature Ranges (TMIN to TMAX
AS1100xL
)
0°C to +70°C
-40°C to +85°C
-65°C to +150°C
+240°C
AS1100xE
Storage Temperature Range
2
Package body temperature
Electrical Characteristics
(VDD = 5V, RSET = 9.53kΩ±1%, TA = TMIN to TMAX, unless otherwise noted.)
Parameter
Conditions
Min
Typ
Max
Symbol
Units
Operating Supply Voltage
VDD
4.0
5.0
5.5
V
All digital inputs at VDD or GND, TA
+25°C
=
Shutdown Supply Current
IDDSD
IDD
20
50
µA
µA
mA
RSET = open circuit
500
Operating Supply Current
All segments and decimal point on, ISEG = -
40mA
330
800
Display Scan Rate
fOSC 8 digits scanned
500
320
-30
1300
-45
Hz
mA
mA
Digit Drive Sink Current
Segment Drive Source Current
Segment Drive Current
Matching
IDIGIT VOUT = 0.65V
ISEG TA = +25°C, VOUT = (VDD -1V)
-40
3.0
%
∆ISEG
Digit Drive Source Current
Segment Drive Sink Current
Logic Inputs
IDIGIT Digit off, VDIGIT = (VDD -0.3V)
ISEG Segment off, VSEG = 0.3V
-2
5
mA
mA
2
The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020B “Moisture/Reflow Sensitivity
Classification for non-hermetic Solid State Surface Mount Devices”.
Revision 1.32, Oct. 2004
Page 2 of 12
AMSCO [ AMS(艾迈斯) ]
