Electrical Characteristics at VIN=14V, VOUT =3V IO =150mA, TJ=25°C, R1 =27k, C2 = 100µF unless otherwise specified.
Electrical Characteristics
AMS2930C
PARAMETER
CONDITIONS
(Note 2)
Units
Min.
Max.
Typ.
Adjustable Version
Reference Voltage
1.14
1.20
1.26
V
V
IO ≤ 150 mA, -40°C ≤T ≤ 125°C, R1=27k,
J
1.08
1.32
Measured from VOUT to Adjust Pin
Output Voltage Range
Line Regulation
3
24
.02
0.3
V
mV
%
1.5
1
VOUT + 0.6V ≤V ≤ 26V
IN
Load Regulation
Dropout Voltage
5mA ≤I ≤ 150 mA
O
I
≤10 mA
0.05
0.3
0.2
0.6
V
V
O
I
= 150 mA
O
Quiescent Current
I
= 10 mA
0.4
15
1
1
mA
mA
mA
O
I
= 150 mA
O
0.8
During Shutdown RL = 500Ω
10Hz-100kHz
Output Noise Voltage
Output Impedance
Long Term Stability
Ripple Rejection
100
40
µVrms/V
mΩ
100mADC and 10mArms,100Hz=10kHz
T =1000hr
0.4
0.02
21
%/1000hr
%/V
fO = 120Hz
Maximum Operating Input
Voltage
22
V
Maximum Line Transient
60
70
V
IO = 10mA, Reference Voltage ≤ 1.5V
T = 1ms, τ ≤100ms
Reverse Polarity Input Voltage,
D/C
-15
-50
-30
-80
V
V
RL = 500Ω, VO ≥ -0.3V
RL = 500Ω, T = 1ms, τ ≤100ms
VO = 3V
Reverse Polarity Input Voltage,
Transient
On/Off Threshold Voltage
On
2.0
2.2
20
1.2
50
V
V
Off
3.25
On/Off Threshold Current
µA
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test
conditions, see the Electrical Characteristics tables.
Note 2: See Circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for
TA = TJ = 25°C.
Note 4: The junction-to-ambient thermal resistance are as follows: 195°C/W for the TO-92 (N) package, 160°C/W for the molded plastic SO-8 (S), 50°C/W
for the TO-220 package and 73°C/W for the TO-263 package. If the TO-220 package is used with a heat sink, θJA is the sum of the package thermal resistance
junction-to-case of 3°C/W and the thermal resistance added by the heat sink and the thermal interface. The thermal resistance of the TO-263 package can be
reduced by increasing the PCB copper area thermally connected to the package: using 0.5 square inches of copper area, ϕ JA is 50°C/W; with 1 square inch of
copper area ϕ JA is 37°C/W; and with 1.6 or more square inches of copper area ϕ JA is 32°C/W.
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