data sheet
Features:
LEADFRAME
PowerSOP
®
2&3
Exceptional performance through the innovative design of PSOPs offer:
•
Up to 50% improvement in Theta JA when slug soldered to board
•
Highly conductive copper heatslug and leadframes
•
Optional PSOP assembly materials for enhanced power capability include soft solder
die attach
•
Available in:
PSOP 2
(.150" body) - 8, 16 lead
(.300" body) - 16, 20, 24, 28 lead
PSOP 3
(11 x 15.9 mm body) - 20, 24, 30, 36, 44 lead
PSSOP
(.150" body) - 16, 28 lead
Single Layer PCB
Pkg
PSOP 2
8
16
PSOP 3
20
Multi-Layer PCB
Pkg
PSOP 2
8
16
PSOP 3
20
Body
Size
3.8 x 4.9
3.8 x 9.9
11 x 15.9
Body
Size
3.8 x 4.9
3.8 x 9.9
11 x 15.9
Pad
Size
2.3 x 3.1
2.3 x 4.9
7.5 x 7.9
Pad
Size
2.3 x 3.1
2.3 x 4.9
7.5 x 7.9
Theta JA (°C/W) by Velocity (LFPM)
0
200
500
S/NS
S/NS
S/NS
144.1/157.6
91.2/95.9
50.8/52.4
120.2/131.1 104.2/112.8
72.2/75.2
61.8/64.4
35.7/37.6
27.8/28.8
PowerSOP
®
Packages:
(PSOP / PSSOP)
This Amkor-developed family of power IC
packages significantly increases the thermal
efficiency of power constrained standard SOIC
packages. The PowerSOP
©
(PSOP) improves
Theta JA up to 50% over a standard SOIC
thereby expanding the margin of operating
parameters. The large integrated exposed
copper heatslug to which the IC chip is direct-
ly attached results in an increased ability to
dissipate heat. The leadframe and heatslug
are mechanically attached, leaving the leads
electrically isolated. The package is offered in
a low stand-off (.002) heatslug down ver-
sion, which is MS-012, MS-013, or MO-166
JEDEC compliant depending on the package
you choose. These flexibilities still allow
maximum thermal management by directly
soldering the slug to the PCB. Furthermore,
there are two types of PSOPs (2 and 3)
available with various features and benefits
to address different market application
needs.
Applications:
Increased end-application densities and
shrinking product sizes demand more from
IC packages. PSOPs give designers the
needed margin for designing and producing
high performing products such as telecom,
disk drives, pagers, wireless, CATV/RF
modules, radio, automotive/industrial and
other similar applications. GaAs, SiGe and
hi-speed silicon technologies work especially
well in PSOP packages due to added
shielding and grounding capabilities.
Thermal Resistance:
g
Theta JA (°C/W) by Velocity (LFPM)
0
200
500
S/NS
S/NS
S/NS
51.8/95.3
30.2/51.6
19.2/25.7
45.5/86.5
25.0/45.3
14.2/20.4
42.6/80.6
23.0/42.3
12.2/17.8
JEDEC Standard Test Boards
Body
Size
4.9 x 3.9
11 x 15.9
4.9 x 3.9
Pad
Size
3.2 x 2.3
7.5 x 7.9
1.3 x 3.2
S - Slug Soldered to Test Board
N/S - Slug Not Soldered to Test Board
Lead
Longest
Shortest
Longest
Shortest
Longest
Shortest
Inductance Capacitance Resistance
Electrical:
Pkg
PSOP 2
8 ld
PSOP 3
20 ld
PSSOP
16 ld
(nH)
(pF)
(m
Ω
)
9.9
5.7
30.6
9.42
12.8
8.36
1.120
0.684
3.130
1.540
1.510
0.885
0.456
0.344
1.990
0.604
0.367
0.243
Reliability:
IC chips are assembled in optimized package designs with proven reliable
semiconductor materials.
•
High temp storage: 150 °C, 1000 hrs.
•
HAST:
130 °C/85% RH, no bias, 96 hours
•
Temp cycle:
-65/150 °C, 500 cycles
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS320G
Rev Date: 01’07
AMKOR [ AMKOR TECHNOLOGY ]
