data sheet
Features:
LEADFRAME
PDIP
Amkor’s PDIP packages offer:
• 300 mil body width - 8, 14, 16, 18, 20, 22, 24 lead
counts available
• 288 mil body width - 28 lead count available
• 400 mil body width - 22 - 30 lead counts available
• 600 mil body width - 24, 28, 32, 40, 42, 48, 52 lead
counts available
• 750 mil body width - 64 lead count available
• High conductivity copper leadframe
• Fused-lead custom configurations
• JEDEC standard compliant
• Wide selection of available pad sizes to meet most die
size needs
• Custom leadframe design capability
• Multi-chip packaging capability
• Full internal electrical test
• Strip Test capability
Reliability:
Plastic Dual In-Line
(PDIP) Packages:
Amkor is committed to continuing to
service this long established standard
industry package. The Amkor PDIP
comes in a wide range of lead counts:
from 8 - 48 leads with a lead pitch of
100 mils. Amkor also provides the
SPDIP package which is a shrink version
of the PDIP with a 70 mil lead pitch and
lead counts ranging from 30 - 64 leads.
The SPDIP provides the option of
decreasing the package size while main-
taining the same lead count. The SPDIP
decreases the board space required on
the PCB to help meet ever-shrinking
space requirements.
PDIP and SPDIP are tested to assure reliable, long term
operation of your die.
•
•
•
•
PCT
Temp cycle
Temp/humidity
High temp storage
121 °C, 2 atm, 168 hours
-65/+150 °C, 1000 cycles
85 °C/85% RH, 1000 hours
150 °C, 1000 hours
Applications:
Along with the other standard industry packages, the PDIP has a proven track record and is still being used by semiconductor technologies such
as logic, memory, microcontrollers, and video controllers. Some end applications are consumer electronics, commercial electronics, automotive
and telecommunications.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS397D
Rev Date: 07’03
AMKOR [ AMKOR TECHNOLOGY ]
