data sheet
Cross-sections
LQFP PowerQuad
®
4
LEADFRAME
LQFP
PowerQuad
®
4
Process Highlights
Die thickness (max)
15.0 mils
Strip solder plating
85/15 Sn/Pb
Strip marking
Pad
Lead inspection
Laser/optical
Pack/ship options
Bar code/dry pack/TNR
Test Services
• Program generation/conversion
• Product engineering
• Wafer sort
• 256 Pin x 20 MHz test system available
• -55 °C to +165 °C test available
• Burn-in
Shipping
Low profile tray (JEDEC Outline CS-007)
Inverted
Configuration Options:
LOW PROFILE POWERQUAD
®
4 PACKAGE FAMILY (units in mm)
Lead
Count
44
44
64
64
80
100
120
128
Body
Size
10 x 10
14 x 14
10 x 10
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
Body
Thickness
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
Lead
Pitch
0.80
1.0
0.50
0.80
0.65
0.50
0.40
0.40
Form
Length
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Tip
To Tip
12.0 x 12.0
16.0 x 16.0
12.0 x 12.0
16.0 x 16.0
16.0 x 16.0
16.0 x 16.0
16.0 x 16.0
16.0 x 16.0
Foot
Length
0.60
0.60
0.60
0.60
0.60
0.60
0.60
0.60
Board
JEDEC
Standoff Package
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
MS-026
MS-026
MS-026
MS-026
MS-026
MS-026
MS-026
MS-026
Tray
Matrix
8 x 20
6 x 15
8 x 20
6 x 15
6 x 15
6 x 15
6 x 15
6 x 15
Units
Per Tray
240
90
240
90
90
90
90
90
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With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
AMKOR [ AMKOR TECHNOLOGY ]
