data sheet
LAMINATE
CABGA/CTBGA/CVBGA
Process Highlights
Die thickness (max)
0.27 mm (10.5 mils)
Bond pad pitch (min)
50
µm
(2 mils)
Marking
Laser
Ball inspection
Optical
Pack options
Dry pack
Wafer backgrinding
Available
Standard Materials
Package substrate
-
Conductor
Copper
-
Dielectric
Epoxy polyimide blend
Die attach adhesive
Low stress elastomer
Encapsulant
Epoxy mold compound
Solder ball
Eutectic SnPb/Pbfree
Test Services
Program Generation/Conversion
Product Engineering
Wafer sort
256 Pin x 20 MHz test system available
-55 °C to +165 °C Test available
Burn-in
Shipping
JEDEC trays
Tape and Reel services
0.65
Ball
Count
0.50
Ball
Count
192
241
181
277
Ball Pitch
Body
Size
15
15
15
15
16
16
17
17
17
17
17
17
19
19
19
21
21
21
21
21
1.0
Ball
Count
160
176
196
144
0.80 0.65
Ball
Ball
Count Count
208
273
324
280
285
256
272
280
292
316
288
324
0.50
Ball
Count
256
TOP VIEW
SIDE VIEW
BOTTOM VIEW
CABGA/CTBGA/CVBGA Standard Package Offering
Ball Pitch
Body
Size
4
4
5
5
6
6
6
6
7
7
7
7
7
8
8
8
8
9
9
9
9
1.0 0.80 0.75
Ball Ball Ball
Count Count Count
16
25
36
49
0.65 0.50
Ball Ball
Count Count
49
40
40
57
48
56
64
84
81
104
108
64
84
96
105 108
111 132
113 144
96
124
Ball Pitch
Body
Size
10
10
10
10
10
10
11
11
11
12
12
12
13
13
13
14
14
1.0
Ball
Count
81
0.80
Ball
Count
100
96
120
121
144
97
109
128
169
144
160
196
200
224
225
192
220
100
97
112
121
108
144
200
223
48
49
64
44
46
48
64
48
208
228
288
289
320
417
287
277
42
64
64
72
81
94
100
72
80
81
300
48
64
176
208
224
228
252
256
280
289
324
256
272
316
336
400
449
180
180
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With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
AMKOR [ AMKOR TECHNOLOGY ]
