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A43P8316V-95I 参数 Datasheet PDF下载

A43P8316V-95I图片预览
型号: A43P8316V-95I
PDF下载: 下载PDF文件 查看货源
内容描述: 1M ×16位×4银行同步DRAM [1M X 16 Bit X 4 Banks Synchronous DRAM]
分类和应用: 动态存储器
文件页数/大小: 42 页 / 502 K
品牌: AMICC [ AMIC TECHNOLOGY ]
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A43L2616B  
Device Operations  
Clock (CLK)  
Power-Up  
The following sequence is recommended for POWER UP  
1. Power must be applied to either CKE and DQM inputs to  
pull them high and other pins are NOP condition at the  
inputs before or along with VDD (and VDDQ) supply.  
The clock signal must also be asserted at the same time.  
2. After VDD reaches the desired voltage, a minimum  
pause of 200 microseconds is required with inputs in  
NOP condition.  
The clock input is used as the reference for all SDRAM  
operations. All operations are synchronized to the positive  
going edge of the clock. The clock transitions must be  
monotonic between VIL and VIH. During operation with CKE  
high all inputs are assumed to be in valid state (low or high)  
for the duration of set up and hold time around positive  
edge of the clock for proper functionality and ICC  
specifications.  
3. Both banks must be precharged now.  
4. Perform a minimum of 2 Auto refresh cycles to stabilize  
the internal circuitry.  
Clock Enable (CKE)  
5. Perform a MODE REGISTER SET cycle to program the  
CAS latency, burst length and burst type as the default  
value of mode register is undefined.  
The clock enable (CKE) gates the clock onto SDRAM. If  
CKE goes low synchronously with clock (set-up and hold  
time same as other inputs), the internal clock is suspended  
form the next clock cycle and the state of output and burst  
address is frozen as long as the CKE remains low. All other  
inputs are ignored from the next clock cycle after CKE goes  
low. When both banks are in the idle state and CKE goes  
low synchronously with clock, the SDRAM enters the power  
down mode form the next clock cycle. The SDRAM  
remains in the power down mode ignoring the other inputs  
as long as CKE remains low. The power down exit is  
synchronous as the internal clock is suspended. When  
CKE goes high at least “tSS + 1 CLOCK” before the high  
going edge of the clock, then the SDRAM becomes active  
from the same clock edge accepting all the input  
commands.  
At the end of one clock cycle from the mode register set  
cycle, the device is ready for operation.  
When the above sequence is used for Power-up, all the  
out-puts will be in high impedance state. The high  
impedance of outputs is not guaranteed in any other  
power-up sequence.  
cf.) Sequence of 4 & 5 may be changed.  
Mode Register Set (MRS)  
The mode register stores the data for controlling the  
various operation modes of SDRAM. It programs the CAS  
latency, addressing mode, burst length, test mode and  
various vendor specific options to make SDRAM useful for  
variety of different applications. The default value of the  
mode register is not defined, therefore the mode register  
must be written after power up to operate the SDRAM. The  
Bank Select (BA0, BA1)  
This SDRAM is organized as 4 independent banks of  
1,048,576 words X 16 bits memory arrays. The BA0, BA1  
mode register is written by asserting low on  
,
,
CS RAS  
, (The SDRAM should be in active mode with  
WE  
inputs is latched at the time of assertion of  
and  
CAS  
RAS  
CAS  
to select the bank to be used for the operation. The bank  
select BA0, BA1 is latched at bank activate, read, write  
mode register set and precharge operations.  
CKE already high prior to writing the mode register). The  
state of address pins A0~A11, BA0 and BA1 in the same  
cycle as  
,
,
,
going low is the data  
WE  
CS RAS CAS  
written in the mode register. One clock cycle is required to  
complete the write in the mode register. The mode register  
contents can be changed using the same command and  
clock cycle requirements during operation as long as both  
banks are in the idle state. The mode register is divided  
into various fields depending on functionality. The burst  
length field uses A0~A2, burst type uses A3, addressing  
mode uses A4~A6, A7~A8, A11, BA0 and BA1 are used for  
vendor specific options or test mode. And the write burst  
length is programmed using A9. A7~A8, A11, BA0 and BA1  
must be set to low for normal SDRAM operation.  
Address Input (A0 ~ A11)  
The 20 address bits required to decode the 262,144 word  
locations are multiplexed into 12 address input pins  
(A0~A11). The 12 bit row address is latched along with  
, BA0 and BA1 during bank activate command. The 8  
RAS  
bit column address is latched along with  
and BA1during read or write command.  
,
, BA0  
WE  
CAS  
NOP and Device Deselect  
Refer to table for specific codes for various burst length,  
addressing modes and CAS latencies.  
When  
,
and  
are high, the SDRAM  
WE  
CAS  
RAS  
performs no operation (NOP). NOP does not initiate any  
new operation, but is needed to complete operations which  
require more than single clock like bank activate, burst  
read, auto refresh, etc. The device deselect is also a NOP  
and is entered by asserting  
high.  
high disables  
CS  
CS  
the command decoder so that  
,
and  
, and  
WE  
CAS  
RAS  
all the address inputs are ignored.  
(December, 2009, Version 1.3)  
11  
AMIC Technology, Corp.