11.0 MODULE OUTSIDE DIAGRAM
A simplified ISO drawing of the module housing is shown Figure 3. Mechanical Structure. It
is not to scale, but sufficient dimensions are shown for use in a preliminary application
study. Furthermore, it shows the I/O connector location, its pin 1 location, the read line
location and LED pad locations. For detailed design information, please contact Peripheral
Image Corporation for a complete housing drawing.
FIGURE 3. MECHANICAL STRUCTURE
©2003 Peripheral Imaging Corporation. Printed in USA. All rights reserved. Specifications
are subject to change without notice. Contents may not be reproduced in whole or in part without
the express prior written permission of Peripheral Imaging Corporation. Information furnished
herein is believed to be accurate and reliable. However, no responsibility is assumed by Peripheral
Imaging Corporation for its use nor for any infringement of patents or other rights granted by
implication or otherwise under any patent or patent rights of Peripheral Imaging Corporation.
PAGE 10 OF 10 - PI630MC-A6C, 11/19/03
AMI [ AMI SEMICONDUCTOR ]
