TABLE 7.2 CLOCK TIMING CHARACTERISTICS, SEE FIGURE 3. TIMING DIAGRAM
This table is defines the symbols used in the timing diagram, Figure 3. Timing Diagram. It is for
a single video section. However it applies to all eight video sections. Accordingly, the system-
timing diagram is a composition of this timing diagram repeated eight times with all waveforms in
parallel, so electrically the system produces pixels from all eight video section simultaneously.
ITEM
SYMBOL
MIN.
TYPICAL
MAX.
UNITS
CLOCK CYCLE TIME
(2)
CLOCK PULSE WIDTH
(2)
CLOCK DUTY CYCLE
(2)
PROHIBIT CROSSING TIME
OF START PULSE
DATA SETUP TIME
DATA HOLD TIME
SIGNAL DELAY TIME
to
tw
duty
tprh
tds
tdh
tdl
0.1666
25
30
30
25
0.200
0.100
50
10
75
ms
ns
%
ns
ns
ns
ns
75
SIGNAL SAMPLE TIME
tsmp
(3)
125
ns
SIGNAL FALL TIME
tsigf
75
ns
(4)
RECOMMEND SP
Tonoff
GENERATION
1. Applies to whole chart. All of the symbol definitions in above table are used in Figure 3,
TIMING DIAGRAM. For the complete system, there are only two clocks, CP, and start
pulse, SP and there logic levels are compatible with CMOS 74HCXX series logic devices.
2. See the notes on clock periods (the inverse of FREQ) and their duty cycle under Table
5.1 notes 3 and 4.
3. See PI3039 DATA SHEET page 6, Table 6A, note 6.
4. Recommend method for SP generation because the shift register loads only on the falling
edge.
8.0 MAXIMUM RATINGS
TABLE 8.1 MAXIMUM RATINGS (Not to be used for continuous operation)
ITEM
SYMBOL
SPECIFICATION
DC SUPPLY VOLTAGE
VDD
7V
INPUT VOLTAGE
AMBIENT TEMPERATURE
(1)
VIN
TA (PCB Surface)
0 TO VDD+0.3
0 TO 70
O
C (See note,
below.)
-10
O
to +75
O
C (See
note, below.)
0 to 80% (See note)
70
O
C (See note,
below.)
NOTE
SP & CP
Operational
Storage
Non
Condensing
AMBIENT HUMIDITY
(1)
MAXIMUM OPERATING
CASE TEMPERATURE
(1)
HA
PCB Temperature
Note (1) All referenced parameters are conservative engineering estimate based on few of the
prototype PCB. They are based on measurements of similar CIS modules and/or
simple bench top tests using heat guns and freeze sprays. However these parameters
will be re-measured during the pilot production using standard QA practices that is
under the control of ISO 9000 regulations.
PAGE 8 OF 22 - PI616MC-AS, 12/20/02
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