PI6049A Data Sheet
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Bonding Pad Layout Diagram
Figure 2 shows the bonding pad locations for the PI6049A sensor.
14560µm
380µm
Figure 2. Bonding Pad Locations
Wafer Scribe Line
Figure 3 outlines the scribe line dimensions surrounding the sensor die on a wafer.
60µm
15µm
380µm
55µm
14560µm
55µm
60µm
Figure 3. Wafer Scribe Line
Page 5 of 13, Revised 2-13-04