N256S0818HDA/N256S0830HDA
Advance Information
AMI Semiconductor, Inc.
8-Lead Plastic Small Outline, 150mil SOIC
E
E1
p
D
α
B
A2
A1
A
h
45o
c
φ
β
L
Parameter
Sym
Min
Nom
Max
Pin Pitch
Overall height
Molded Package Thickness
Standoff
p
A
A2
A1
E
E1
D
h
1.27
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.35
1.32
0.10
5.79
3.71
4.80
0.25
0.48
0
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
L
Foot Angle
φ
Lead Thickness
Lead Width
c
B
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
Mold Draft Angle Top
α
β
Mold Draft Angle Bottom
0
12
15
Note:
1. All dimensions in Millimeters
2. Package dimensions exclude mold flash and protusions.
13
This is a developmental specification and is subject to change without notice.
AMI [ AMI SEMICONDUCTOR ]
