AME
Low Dropout
600mA CMOS Regulator
AME8819
n Thermal Information
Parameter
Package
Die Attach
Symbol Maximum
Unit
Conductive Epoxy
40
SOT-89*
Non-Conductive
Epoxy
46
Thermal Resistance
(Junction to Case)
oC / W
Conductive Epoxy
qJC
qJA
PD
25
SOT-223*
SOP-8**
SOT-89
Non-Conductive
Epoxy
31
Conductive Epoxy
Conductive Epoxy
60
180
180
120
135
150
550
550
900
800
810
150
350
Non-Conductive
Epoxy
Thermal Resistance
(Junction to Ambient)
oC / W
Conductive Epoxy
SOT-223
SOP-8
Non-Conductive
Epoxy
Conductive Epoxy
Conductive Epoxy
SOT-89
Non-Conductive
Epoxy
Internal Power Dissipation
Conductive Epoxy
mW
SOT-223
SOP-8
Non-Conductive
Epoxy
Conductive Epoxy
oC
oC
Maximum Junction Temperature
Solder Iron(10 Sec)***
* Measure qJC on backside center of tab.
** Measure qJC on center of molding compound if IC has no tab.
*** MIL-STD-202G 210F
Rev.B.01
9
AME [ ANALOG MICROELECTRONICS ]
